Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications)

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Not every article in a journal is considered primary research and therefore "citable", this chart shows the ratio of a journal's articles including substantial research research articles, conference papers and reviews in three year windows vs. Ratio of a journal's items, grouped in three years windows, that have been cited at least once vs. The purpose is to have a forum in which general doubts about the processes of publication in the journal, experiences and other issues derived from the publication of papers are resolved. For topics on particular articles, maintain the dialogue through the usual channels with your editor.

Year SJR 0.

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Solid Mechanics and its Applications

Year International Collaboration Documents Year Value Non-citable documents 0 Non-citable documents 8 Non-citable documents 18 Non-citable documents 30 Non-citable documents 34 Non-citable documents 28 Non-citable documents 16 Non-citable documents 7 Non-citable documents 5 Non-citable documents 8 Non-citable documents 14 Non-citable documents 12 Non-citable documents 9 Citable documents 0 Citable documents Citable documents Citable documents Citable documents Citable documents Citable documents Citable documents 83 Citable documents 76 Citable documents 83 Citable documents Citable documents Citable documents Basic circuit design, standard microelectronic circuits.

Digital data acquisition and control. Designing and testing analog circuits. Electronics and Instrumentation II Prerequisites: Continuation of ENME Vibration, Controls, and Optimization I Prerequisites: Fundamentals of vibration, controls, and optimization. Analysis and design in time, Laplace, and frequency domains.

Recommended articles

Mathematical description of system response, system stability, control, and optimization. Optimal design of mechanical systems. Product Engineering and Manufacturing Prerequisite: Business aspects of engineering product development.

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Relationship of design and manufacturing. Engineering Materials and Manufacturing Processes Prerequisite: Basic material structures and properties. Mechanical behavior of materials.

Lecture 1 - Course Handout

Integrated statistical methodology for improvement of products and processes in terms of performance, quality, and cost. Chao is co-advised with Prof. Seeking talented graduate students. Ho, Scaling properties of nano-engineered polyurea aerogel, in preparation. Micro-electronics and devices [4] C.

Reliability challenges in the nanoelectronics era - ScienceDirect

Ho, Plasticity mechanism for copper extrusion in through-silicon vias for three-dimensional interconnects, Appl. Ho, Study of stresses and plasticity in through-silicon via structures for 3D interconnects by x-ray micro-beam diffraction. Ho, Impact of grain structure and material properties on via extrusion in 3D interconnects, Journal of Microelectronics and Electronic Packaging, Vol.

Interfacial Fracture Mechanics [4] C. Liechti, Varying interfacial interaction between Cu and Graphene interface, in preparation.


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Liechti, Effect of traction-separation relation on mode-mix of tri-layer fracture, in preparation. Liechti, A method for determining mixed-mode traction-separation relations of an interface, submitted. Bond of Reinforcement in Concrete [6] C. Chen, Modified shear-lag model simulating strain response of lap-spliced coated reinforcement, in preparation.

Wu, Limitation of coating effect on bond enhancement between deformed rebar and concrete, in preparation.

Mechanics of Microelectronics (Solid Mechanics and Its Applications) [Hardcover]

Koenigstein, Global bond behavior of enamel coated rebar in concrete beams with spliced reinforcement, Construction and Building Materials, Vol. Koenigstein, Local bond strength of vitreous-enamel coated reinforcement in normal strength concrete, Construction and Building Materials, Vol.


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Wu, Recent advances in the development and application of chemically reactive enamel coating for steel bars, Science China Technological Sciences, Vol. Numerical Modeling [2] J. Lin, Modeling crack propagation with the extended scaled boundary finite element method based on the level set method, Computers and Structures, Vol.

Structural Health Monitoring [1] Z.